PCB design tips

Suggestions on placing the MOSFETs to prevent ringing LT Spice circuit simulation for begginers

General guideliness

Based on the Eric Bogatin on Breaking Bad Habits in PCB Design.Some additional details in his article Signal trace width - 6 mil (1 Amp max) Power traces - 20 mil (3 Amp max) Drilled diameter for signal traces - 13 mil - narrow via to get higher interconnectency If one must route something on bottom layer, make path short and use bridges (return strap) as on the picture:

Algorighm for choosing the capacitance is to flat out the previous circuit impedance (as looking from the end- Microcontroller for example) to the beggingin (Voltage source)

In particular, when chosing capcitance, try to flat out the peak from the previous capacitance in the circuit:

Initial resons for having several capacitance:

Smaller value would have lower inductance (to lower down impedance on higher frequences)
Larger values will provide needed capacitance for the device

Some useful guideliness from YouTube
Careful about the return paths:

For more information on return paths check Understanding return paths

Suggestion on ground connection:

Watch out traces:

Paths when decopling introduced:

Reason behind twisting the power cables:

Thermal via size is important- if too large, termal vias will wick the solder material which can result in poor connection of the termal pad to the package. Based on Texas instruments application note it is suggested to use 0.33mm drill size via, or smaller (with copper plated barrell for conductivity)